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Trade Fair

NEPCON JAPAN, Tokyo, Jan 22-24 2025

IC & SENSOR PACKAGING EXPO Takashima Sangyo joins the Integrated Circuit & Sensor Packaging Expo of NEPCON JAPAN 2025 in Tokyo, January 22-25 2025. Venue: Tokyo Big SightTime: January 24-25, 2025Booth: E65-60 Contract services of semiconductor back-end process: wafer back-grinding, dicing, dicing before grinding available. Pre-registration of visitors at official site would be recommended

JIMTOF 2024, November 5-10

Takashima Sangyo has exhibited the latest version of MultiPro6, a compact machining center, at the Japan International Machine Tool Fair, JIMTOF,. Venue Tokyo Big Sight Time November 5 – 10 2024 Our Booth E1040 MultiPro6 employing Selective Compliance Assembly Robot Arm for further productivity improvement (center), and a laser processing model (right)

SUWA-KEN KOGYO MESSE, Oct 17-19 2024

Takashima presented our expertise in precision machining and small machine tools at a local trade fair, SUWA-KEN KOGYO MESSE, Oct 17-19 2024 the Nagano Suwa Area Industrial Messe 2024. Booth: West 025