Other Products and Services

Please contact us for further information through the contact form. Thank you.

Ruby Nozzle

Orifice size: min. 10 micron meter (5 micron meter processable)

Synthetic Ruby, Zirconia, Tungsten carbide

Metal nozzle is also available

Subcontract service of semiconductor wafer: back-grinding, dicing, and inspection

“Dicing Before Grinding” is available.

Multi-Pro Machining Center

Currently this machine is for Japanese market only. We apologize for the inconvenience.

Takashima Sangyo Co., Ltd.
5695-6 Kanazawa, Chino, Nagano 391-0012, JAPAN
Tel 81-266-72-8833 (main)
Fax 81-266-82-3316 (main)