News and Trade Fair
Takashima Sangyo Co., Ltd. are proud to be part of the Suwa-ken Kogyo Messe, a very local trade fair. If you are driving past, come in and see our products. Venue: main Okaya Civic Gimnasium, satellite Okaya Techno Plaza Time: from June 26 to 28, 2025Booth: to be confirmed
Takashima Sangyo Co., Ltd. will be at the Mechanical Components & Technology Expo Tokyo to exhibit its precision machined parts and a small machine tool “Multi-Pro” . Venue Makuhari MesseTime July 9 to 11 2025Booth to be confirmed
IC & SENSOR PACKAGING EXPO Takashima Sangyo joins the Integrated Circuit & Sensor Packaging Expo of NEPCON JAPAN 2025 in Tokyo, January 22-25 2025. Venue: Tokyo Big SightTime: January 24-25, 2025Booth: E65-60 Contract services of semiconductor back-end process: wafer back-grinding, dicing, dicing before grinding available. Pre-registration of visitors at official site would be recommended
