News and Trade Fair
Takashima Sangyo Co., Ltd. are proud to be part of the Suwa-ken Kogyo Messe, a very local trade fair. If you are driving past, come in and see our products. Venue: main Okaya Civic Gimnasium, satellite Okaya Techno Plaza Time: from June 26 to 28, 2025Booth: to be confirmed
Takashima Sangyo Co., Ltd. will be at the Mechanical Components & Technology Expo Tokyo to exhibit its precision machined parts and a small machine tool “Multi-Pro” . Venue Makuhari MesseTime July 9 to 11 2025Booth to be confirmed
Takashima Sangyo Co., Ltd. are ready to present our precision medical parts at the MEDTEC 2025 TOKYO held in the next week: laser processed stent, micro forceps, boring biopsy needle, thinner stent under 0.1mm of diameter, fine ceramic nozzle with orifice diameter 10 micron meter. We look forward to meeting you there. MEDTEC 2025, TokyoTime April 9-11 2025Venue Tokyo Big SightStand No. 200
A plunger is a part of spring-load contact probe, a semiconductor testing device. The outer diameter of item in this photo is 0.1mm. Takashima Sangyo supplies various plungers with wide range of specifications. We manufacture them in Japan, Vietnam and China.
IC & SENSOR PACKAGING EXPO Takashima Sangyo joins the Integrated Circuit & Sensor Packaging Expo of NEPCON JAPAN 2025 in Tokyo, January 22-25 2025. Venue: Tokyo Big SightTime: January 24-25, 2025Booth: E65-60 Contract services of semiconductor back-end process: wafer back-grinding, dicing, dicing before grinding available. Pre-registration of visitors at official site would be recommended
Takashima Sangyo has exhibited the latest version of MultiPro6, a compact machining center, at the Japan International Machine Tool Fair, JIMTOF,. Venue Tokyo Big Sight Time November 5 – 10 2024 Our Booth E1040 MultiPro6 employing Selective Compliance Assembly Robot Arm for further productivity improvement (center), and a laser processing model (right)
Address Change China Factory
