Back-end semiconductor process: back-grinding, dicing, packaging tips into tray
You can order even one piece of prototype wafer for your project.
Utilizing our technology accumulated over decades, we provide you with high-quality and reliable after-follow suitable for your needs. We offer you IC wafer back-end process, back-grinding, dicing, packaging tips into tray and so forth, as contract processing. Stable quality for thinner tips can be guaranteed by Dicing Before Grinding (DBG) process. We would also propose you new ideas including fabrication of components with silicon tips by our internal teamwork. Recently we are taking on the challenging materials like SiC power semiconductor, too.
It is our pleasure if our technology can be a help for your product development, trial production, design review, and condition setting with new materials of next generation. Feel free to contact us.
Wafer after back grinding
Dicing wafer
Picking tips up
Dicing Before Grinding (DBG) process
Amazing Finish, High-Quality, Thinner IC Tips!
Ultra thin tips are simply achievable by DBG process!
What is DBG process？
The usual process for thinner wafer is fully dicing after grinding. In reverse, in DBG, the wafer is half-cut and then back-ground to separate tips from the wafer. This DBG process can significantly reduce breakage of backside of wafer.
Conventional process Breakages of wafer can be observed on its backside.
DBG process