Plating

Electrical Plating for the Trend of Minimizing Electric / Semiconductor Devices

We provide fine technologies of surface treatment to achieve cost saving and functional advancement for wide-range of materials; Electric plating to very small precision metal parts, Partial electric plating, Plating on hollow hole, Tumbler Polishing, Chemical polishing, Chemical deburring.

We persist in the Inspection-Evaluation-Analysis process to ensure our quality. We are developing new technology of surface treatment too. Please feel free to contact us and let us know your needs.

Electric Nickel/Gold Plating (wet) for very small precision parts, such as a plunger for spring contact probe

Gold plating for very small parts

Partial plating

Partial Gold plating
Partial Nickel plating

Gold plating to inside of hollow hole

Very small parts

Plungers for contact spring probe, semiconductor testing device

Automatic Plating Line

Automatic Plating Line

Automatic Rinse Baths

Deburring by Chemical Polishing

Deburring by chemical polishing

Before and After

X-ray thickness gauge
low vacuum Scanning Electron Microscope and Energy Dispersive X-ray Analyzer
Non-contact Surface Roughness Tester

X-ray Thickness Gauge

low vacuum Scanning Electron Microscope (SEM) and Energy Dispersive X-ray Analyzer (EDX)

Non-contact Surface Roughness Tester

Magnifies image by Scanning Electron Microscope (SEM)
Magnified image by Scanning Electron Microscope (SEM)

Magnified images by SEM

Spectrum analysis by Energy Dispersive X-ray Analyzer (EDX)

Spectrum analysis by EDX

Nitrogen atmosphere tempering furnace

Nitrogen atmosphere tempering furnace

High resolution electronic balance

High resolution electronic balance

Vacuum Drier

Before and After

Tumbler Polishing

Takashima Sangyo Co., Ltd. Suwa Factory
Suwa Business Division
2-1-21 Shimizu, Suwa, Nagano, Japan