Craftsmanship instilled in the manufacturer’s DNA of Takashima Sangyo
Three core technologies, precision processing, high-accurate processing, and processing difficult-to-cut materials, are our fundamental competence. We integrate traditional technique into latest technologies. Passions are overflowed from our inherited genes for challenging ourselves.

Processing of ultra-thin semiconductor wafer, ultra-small wafer tips, as back-end process contract services
Takashima Sangyo Co., Ltd.
5695-6 Kanazawa, Chino, Nagano 391-0012, JAPAN
Tel 81-266-72-8833 (main)
Fax 81-266-82-3316 (main)